Tera Probe, Inc. engages in wafer testing, final testing, testing technology development, and worker dispatching both in Japan and internationally. The company is headquartered in Yokohama, Kanagawa-Ken and currently employs 1,042 full-time employees. The company went IPO on 2010-12-16. The semiconductor manufacturing process is generally divided into the front-end process, where semiconductor chips are fabricated on wafers, and the back-end process, where semiconductor chips are assembled and packaged. The inspection performed in the front-end process is called wafer testing, and the inspection performed in the back-end process is called final testing. The Group undertakes both testing processes. Furthermore, the Company contributes to reducing customers' wafer test costs through contracted program development and probe card design, comprehensive support from device evaluation to mass production, and proposals for improving test efficiency.