ASE Technology Holding Co., Ltd. (ASX) Dividendos

ASE Technology Holding Co., Ltd. engages in the provision of semiconductor manufacturing services. The company is headquartered in Kaohsiung, Kaohsiung. The company went IPO on 2018-04-30. The investment business includes general investment business projects. The packaging and testing business provides integrated circuit (IC) services, including packaging and module design, IC packaging, multi-chip packaging, micro and hybrid modules, memory packaging, front-end testing, wafer probe testing, finished product testing, substrate design, and manufacturing. The electronic manufacturing service business mainly provides a series of professional services such as development and design, material procurement, production and manufacturing, logistics, maintenance and other after-sales services for domestic and foreign brand manufacturers in the fields of communications, consumer electronics, computers, storage industrial, automotive electronics and other types of electronic products.